Thermal behaviour of silver-filled epoxy adhesives : Technological implications in microelectronics

One-component silver-filled epoxy adhesives electrically conductive with low extractable ionic content have been used in microelectronics for attach applications. For the specific application described here there was evidence showing that adhesive polymerisation was not complete with negative consequences for the electronic devices. The present study aimed at understanding the causes of such disadvantages and setting up the best conditions to make the epoxy adhesive perfectly suitable for the required applications.