Effect of N2 dielectric barrier discharge treatment on the composition of very thin SiO2-like films deposited from hexamethyldisiloxane at atmospheric pressure

The continuous deposition of thin SiO2-like films by means of a dielectric barrier discharge with helium or nitrogen gas with small admixture of hexamethyldisiloxane (HMDSO) has been compared to a layer-by-layer deposition process, in which a very thin (0.7 nm and 2.5 nm) films are deposited from HMDSO precursor and treated afterwards by a pure N2 dielectric barrier discharge (DBD). Presented results clearly show that a carbon-free SiO2-like films can be obtained in the latter process, even if the continuous deposition led to carbon-rich material. Surface reactions of N2-DBD generated excited species (metastables, ions, or possibly photons) with surface bonded carbon are responsible for this effect. Moreover, OH-free and oxidation-resistant films can be produced even at the room substrate temperature.