Ag Ion Soldering: An Emerging Tool for Sub-nanomeric Plasmon Coupling and Beyond

ConspectusSelf-assembly represents probably the most flexible way to construct metastructured materials and devices from a wealth of colloidal building blocks with synthetically controllable sizes, shapes, and elemental compositions. In principle, surface capping is unavoidable during the synthesis of nanomaterials with well-defined geometry and stability. The ligand layer also endows inorganic building blocks with molecular recognition ability responsible for their assembly into desired structures. In the case of plasmonic nanounits, precise positioning of them in a nanomolecule or an ordered nanoarray provides a chance to shape their electrodynamic behaviors and thereby assists experimental demonstration of modern nanoplasmonics toward practical uses. Despite previous achievements in bottom-up nanofabrication, a big challenge exists toward strong coupling and facile charge transfer between adjacent nanounits in an assembly. This difficulty has impeded a functional development of plasmonic nanoassemblies...