Single-wafer technology in a 300-mm wafer fab

In this paper, we describe a new technology implemented with all single-wafer processing in a 300-mm wafer fab. Newly developed wet clean solutions successfully reduce processing time one tenth compared with conventional batch clean. The process has been re-integrated to eliminate all of long-time processes. As the results, a very aggressive cycle time of 0.25 days/layer has been demonstrated with high yield and excellent reliability on double-Polysilicon, sextuple-Metal, 0.18um LOGIC. Chamber Sensitivity Analysis is applied to detect problematic chambers enlarging process variability, degrading yield/reliability. It is essential for quick yield ramp up on single-wafer fab.