Study on the high reliability performance and high thermal conductivity epoxy molding compound

High thermal conductivity Epoxy Molding compound (EMC) was formulated by using fully spherical aluminum oxide. With 88% of filler content, it is able to achieve thermal conductivity of 3.0 W/(m.K) with high reliability. The effect of crystalline silica: spherical aluminum oxide ratio on thermal conductivity was also investigated. Types of resin which affected the adhesion, flexural strength and water absorption has a great impact on the reliability performance of semiconductor devices.