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CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density
CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density
2006
Takeshi Furusawa
D. Kodama
Hiroshi Miyazaki
Masahiro Matsumoto
Junko Izumitani
H. Matsumoto
Shoichi Fukui
K. Hashimoto
S. Tawa
M. Okada
Kazuo Tomita
Y. Nagaki
Y. Minoura
A. Ishii
N. Amou
Kenichi Mori
Kazuyoshi Maekawa
Naohito Suzumura
Kazuhito Honda
Yukinori Hirose
A. Osaki
Keywords:
Metallurgy
Alloy
Materials science
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