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Shoichi Fukui
Shoichi Fukui
Renesas Electronics
Metallurgy
Alloy
Materials science
Electromigration
Barrier layer
2
Papers
5
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Effects of Ru-Ta Alloy Barrier on Cu Filling and Reliability for Cu Interconnects
2008
IITC | International Interconnect Technology Conference
Kenichi Mori
Kazuyuki Ohmori
Naoki Torazawa
Shuji Hirao
Syutetsu Kaneyama
Hayato Korogi
Kazuyoshi Maekawa
Shoichi Fukui
Kazuo Tomita
Makoto Inoue
Hiroyuki Chibahara
Yukari Imai
Naohito Suzumura
K. Asai
Masayuki Kojima
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Citations (5)
CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density
2006
The Japan Society of Applied Physics
Takeshi Furusawa
D. Kodama
Hiroshi Miyazaki
Masahiro Matsumoto
Junko Izumitani
H. Matsumoto
Shoichi Fukui
K. Hashimoto
S. Tawa
M. Okada
Kazuo Tomita
Y. Nagaki
Y. Minoura
A. Ishii
N. Amou
Kenichi Mori
Kazuyoshi Maekawa
Naohito Suzumura
Kazuhito Honda
Yukinori Hirose
A. Osaki
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