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Evaluation of Cu CMP Barrier Slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology
Evaluation of Cu CMP Barrier Slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology
2011
Feng Zhao
Laertis Economikos
Wei-Tsu Tseng
Hyun-Ki Kim
Edward Engbrecht
Theodorus E. Standaert
Jing Hui Li
Wu Ping Liu
Moosung Chae
Lee M. Nicholson
Sujatha Sankaran
Keywords:
Low-k dielectric
Slurry
Composite material
Electronic engineering
Materials science
Chemical engineering
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