1.10 – Electrodeposition

The fundamental principles of electrodeposition are reviewed, with emphasis on the processes and materials science most relevant to microsystems. Some of the issues associated with electroplating or electroforming through lithographic patterns are covered, including workpiece and feature scale uniformity, wetting and bubbles in micropatterned features, internal stresses, and adhesion. The properties of electrodeposits of interest to microsystem engineers are discussed, specifically mechanical properties such as hardness and yield strength. Additionally, several material systems and associated applications are provided, including copper and gold for electrical systems, nickel and high-strength nickel alloys for structural components, and bismuth telluride alloys for thermoelectric energy conversion.