Novel Large-Area Attachment for High-Temperature Power Electronics Module Application

Soft soldering is still the standard bonding method in order to provide a large void-free joining area in power electronics module applications. Ag sintering has been proven for small-area die attach applications to increase junction temperature and reliability. In this paper, we explore silver sintering technology further for large-area high-temperature substrate bonding in order to enable full benefits of SiC power semiconductors in terms of higher junction temperature, higher power density and higher reliability.