Study of Temperature Field Distribution and Deformation of Chain Link Based on Pro/E

This paper studies the temperature field variation of the chain link as well as the stress and deformation distribution of the pin which works in hot forging and stamping production line with heat recovery function. The approach is to build the model of the chain link with Pro/Engineer and apply it to the simulation with Pro/Mechanica. To be specific, it is to stimulate the thermal conduction of the chain link and the stress state of the pin under high temperature with Pro/Mechanica-Thermal and Pro/Mechanica-Structure module, respectively. The results are the temperature filed nephogram of the chain link as well as the stress and deformation nephogram of the pin. The simulation shows that:1) the temperature reaches 420°C at the contacts of the outer and inner plates at 600s, 2) the maximum stress of the pin is 112Mpa at the ends where the pin meets the outer and inner plates,3) the pins max deformation is 0.0159mm at the middle of the pin. Comparing the simulation to the actual temperature at the contacts of the outer and inner plates,which is measured ten times in advance with average of 439°C ,the simulation is favorable. According to the results above, graphite lubrication should be chosen for the chain and the pin can work properly with deformation rate of 0.795. By this way of simulating with Pro/Mechanica, complicated calculations and repeated tests can be reduced largely, meanwhile, useful parameters and mathematical model can also be provided for manufacturing and process control.