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Integration of fine-pitched Through-Silicon Vias and Integrated Passive Devices
Integration of fine-pitched Through-Silicon Vias and Integrated Passive Devices
2011
Dzafir Shariff
Pandi C. Marimuthu
Kenneth C. Hsiao
Lily Asoy
Chia Lai Yee
Aung Kyaw Oo
Keith Buchanan
Kath Crook
Tony Wilby
Stephen F Burgess
Keywords:
Through-silicon via
Temperature cycling
Electronic engineering
Silicon
Materials science
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