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Aung Kyaw Oo
Aung Kyaw Oo
STATS ChipPAC Ltd
Temperature cycling
Electronic engineering
Silicon
Materials science
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10
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モバイル3D ICの積み重ねのTSV MEOL(中間の端部)とパッケージング技術
2014
ECTC | Electronic Components and Technology Conference
Na Duk Ju
Aung Kyaw Oo
Choi Won-Kyung
Kida Tsuyoshi
Ochiai Toshihiko
Hashimoto Tomoaki
Kimura Michitaka
Kata Keiichirou
Yoon Seung Wook
Yong Andy Chang Bum
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Integration of fine-pitched Through-Silicon Vias and Integrated Passive Devices
2011
ECTC | Electronic Components and Technology Conference
Dzafir Shariff
Pandi C. Marimuthu
Ken Hsiao
Lily Asoy
Chia Lai Yee
Aung Kyaw Oo
Keith Buchanan
Kath Crook
Tony Wilby
Steve Burgess
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Citations (6)
Integration of fine-pitched Through-Silicon Vias and Integrated Passive Devices
2011
Electronic Components and Technology Conference
Dzafir Shariff
Pandi C. Marimuthu
Kenneth C. Hsiao
Lily Asoy
Chia Lai Yee
Aung Kyaw Oo
Keith Buchanan
Kath Crook
Tony Wilby
Stephen F Burgess
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Citations (4)
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