Old Web
English
Sign In
Acemap
>
Paper
>
Simple, compact, robust and high-performance power module T-PM (transfer-molded power module)
Simple, compact, robust and high-performance power module T-PM (transfer-molded power module)
2010
Ueda
Yoshimatsu
Kimoto
Nakajima
Kikuchi
Shinohara
Keywords:
transfer
Reliability (semiconductor)
Power module
current distribution
Electrical engineering
Thermal resistance
simple
lead bonding
Computer science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]