High‐resolution image of the geometry and thickness of the subducting Nazca lithosphere beneath northern Chile

2011 
[1] Results obtained from S and P receiver functions produced a clear image of the top and bottom of the subducting Nazca lithosphere beneath northern Chile. Using data from the teleseismic events recorded at 15 permanent Integrated Plate Boundary Observatory Chile (IPOC) stations, we obtained new constraints on the geometry and thickness of the descending Nazca lithosphere. We observed the subducted crust of the Nazca plate at depths ranging from 50 km beneath the Coastal Cordillera down to 110 km beneath the Western Cordillera. We found significant along-strike variations in the geometry of the Nazca plate beneath northern Chile. On closer inspection, it appears that the oceanic Nazca plate is divided into two distinct segments as it descends beneath the continental South American plate. The transition from the relatively steeper (∼23°) and deeper slab to the north of 21°S to the flatter southern segment (∼19°) is shown reasonably clearly by our data. This feature could well be associated with variations in the curvature of the plate margin and the geometry of the Chile trench, which is mainly curved to the north of 21°S. We have also mapped the continental Moho of the South American plate at depths ranging between 60 and 70 km to the east of the Longitudinal Valley. Beneath the Coastal Cordillera, this boundary becomes invisible, probably due to the serpentinization of the forearc mantle wedge that reduces the velocity in the uppermost mantle. The base of the subducted Nazca plate was clearly identified as a sharp boundary in the results obtained from the P and S receiver functions. The thickness of the subducted oceanic Nazca plate, which has an age of ∼50 My, is estimated to be ∼50 km. Although this thickness is consistent with that predicted by thermal gradients, the explanation of the sharpness of the lithosphere-asthenosphere boundary may require another mechanism such as hydration or melting.
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