Development of High Reliability Joint of Sn-Bi Solder for 2.3D Organic Package

The 2.3D i-THOP® (jntegrated-Thin film High density Qrganic r_ackage) with Sn-Bi solder joints has been developed for heterogenous die integration solution. The high reliability joint technology in the interposer assembly process using Sn-Bi solder has been established. The Cu-Sn IMCs (!nter-Metallic Compounds) joint with excellent resistance stability was confirmed.