Development of Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications

ABSTRACT High power semiconductor applications such as RF and microwave applications, GaN and SiC power devices and High Brightness LEDs (HBLED), require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. In these types of applications, the main path for heat dissipation is from the device through the die attach material. In order to provide an effective thermal path, it is important for the die attach material to maintain good interfacial contact with backside of the die and substrate. In addition to meeting the necessary thermal performance, die attach materials are required to offer high reliability, ready for high volume manufacturing (HVM), and be readily available while meeting RoHS compliance requirements. Current die attach solutions such as eutectic solders (e.g. AuSn and lead (Pb) solders) have been industry standards offering good reliability and effective thermal conductivity, however both have their drawbacks. High thermal conduc...