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Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon
Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon
2006
Lea Di Cioccio
Beatrice Biasse
Marek Kostrzewa
Marc Zussy
J. Dechamp
Barbara Charlet
Maud Vinet
Jean Marc Fedeli
Thierry Poiroux
Nelly Kernevez
Philippe Regreny
Chrystelle Lagahe-Blanchard
Bernard Aspar
Keywords:
Wafer bonding
Nanotechnology
Silicon
Materials science
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