High performance multilayer thin-film encapsulation for organic micro-displays by inserting in-situ plasma oxidized Al layers between SiOx layers

Multilayer thin-film encapsulation (TFE) plays an important role in Si-based organic micro-displays. In this letter, we demonstrate an efficient and low process-temperature approach to fabricate high-performance barrier films by inserting in-situ plasma oxidized Al layers between SiOx encapsulation layers. Calcium degradation tests show that the water vapor transmission rate (WVTR) of the SiOx/AlOx multilayer barrier film is 2.23×10-8 kgm-2day-1 under the conditions of 25 ℃ and 70% relative humidity after in-situ plasma oxidation treatment for 20 min, which is a reduction of two orders of magnitude compared with single-layer SiOx barrier films.