Application of Al–Nb alloy film to metal capping layer on Cu

An Al–Nb alloy film with the Al72Nb28 composition is applied as a candidate metal capping layer on Cu interconnects. In the Al72Nb28/Cu/SiO2/Si model system, the preferential oxidation of Al forming a thin surface Al2O3 layer occurs owing to oxidation in air for 1 h at temperatures up to ~300 °C, resulting in the protection of the layers underneath from further oxidation, although a slight Cu intermixing into Al–Nb occurs. With increasing oxidation temperature up to 500 °C, the surface Al2O3 layer still grows by the preferential oxidation of Al and rejects Cu atoms from the surface oxidized layer. Although Nb atoms are left behind in the surface oxidized layer, they are in a metallic state owing to the high solubility of oxygen before forming an oxide. The extremely low solubility of Nb in Cu also protects Cu without excess intermixing. A good passivation characteristic of the Al72Nb28 alloy film on Cu is demonstrated.