Blech effect in single-inlaid Cu interconnects

This work demonstrates that we can prevent electromigration failures in single-inlaid copper during DC electromigration testing by taking advantage of the Blech effect. Electromigration tests were performed on single-inlaid copper metal lines ranging from 5 to 250 /spl mu/m in length at 300/spl deg/C and a stress current density of 1.4/spl times/10/sup 6/ A/cm/sup 2/. Shorter lines showed no resistance increase, while longer lines failed at the same time, independent of line length. The critical product (jl)/sub c/ was calculated to be between 2800 and 3500 A/cm at 300/spl deg/C for single-inlaid copper.