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Chemical Mechanical Polishing of Inlaid Copper Structures with Ru/Ta/TaN as Barrier/Liner Layer
Chemical Mechanical Polishing of Inlaid Copper Structures with Ru/Ta/TaN as Barrier/Liner Layer
2018
Jie Cheng
Bingquan Wang
Tongqing Wang
Changkun Li
Xinchun Lu
Keywords:
Copper
Inorganic chemistry
Chemical-mechanical planarization
Chemistry
Chemical engineering
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