Investigation of Self-heating and Thermal Network for Complementary FET

This work investigates the thermal characteristics and thermal reliability of the vertical complementary FET (CFET). As a candidate for 5nm nodes, CFET device suffers severer self-heating and thermal crosstalk than lateral standard CMOS device. A thermal network model is proposed for CFET to rapidly evaluate the temperature variation under AC operating conditions, and the results can be used for preliminary lifetime prediction of thermal-related reliability.