Test method for dispensing electronic process materials.

Robotic dispensing provides flexibility for electronics production not possible from screen-printing processes. As well as the application of solder paste and surface mount adhesives, dispensing systems are utilised with newer technologies such as the application of conductive adhesives, chip on board, glob-tops and flip chip underfills. This document describes test methods for characterising the behaviour of these material types, which should help in optimising the dispensing process and in improving dispensing results.