Novel adhesive tapes for semiconductor manufacturing process

AbstracG To facilitate fabrication of reliable semiconductor devices, adhesive tapes were investigated. Formulated adhesives contained acrylic polymer and epoxy resins. Through a novel design of adhesives, thew versatile adhesive tapes, lint as a pressure sensitive adhesive (PSA) and later as an adhesive material of semiconductors, have been developed. One item was studied as a die bonding tape with Wlthermd dual curing function characteristics. The other item was studied as hack side-coating tape. The die bonding tape was found to be especially effective in the manufacture of die stacked package: The back side-coating tape was useful in exchange for spin coating and screen printing materials. These products respeclively, have been introduced in the market with the name of Adwill" =series and LCseries.