OSTEMER polymer as a rapid packaging of electronics and microfluidic system on PCB

Abstract A new heterogeneous integration method is presented that allows the integration of a microfluidic platform and a multi-channel quartz crystal microbalance array on a printed circuit board (PCB) using a dry adhesive bonding method. In this work, the microfluidic platform is a replica molded using a UV-curable OSTEMER 322 Crystal Clear polymer. The OSTEMER acts both as a final package for the cartridge and as a functional material for hosting molded microfluidic channels, the input reservoirs and the waste reservoir. The method is demonstrated by the integration of an array of 24 of a 150 MHz high fundamental frequency quartz crystal microbalance (HFF-QCM) to the OSTEMER microfluidic packaging. The resulting bond interface is shown to be completely homogeneous and void free, and the package is tested to a differential pressure of up to 4 bars. The leak test of the cartridge is performed by pressurizing a microfluidic channel with an aqueous solution using an external peristaltic pump for more than 4 h. The cartridge performance is evaluated by the electrical characterization. Q-factor values of 9507 and of 650 are achieved in air and DI water, respectively. Results show that this simple integration method of the HFF-QCM is a promising way to integrate microfluidics into the more complex heterogeneous system.