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High density and high-bandwidth chip-to-chip connections with 20μm pitch flip-flop chip on fan-out wafer level package
High density and high-bandwidth chip-to-chip connections with 20μm pitch flip-flop chip on fan-out wafer level package
2018
Arnita Podpod
Dimitrios Velenis
Alain Phommahaxay
Pieter Bex
Ferenc Fodor
Erik Jan Marinissen
Kenneth June Rebibis
Andy Miller
Gerald Beyer
Eric Beyne
Keywords:
Optoelectronics
Flip-flop
Bandwidth (signal processing)
Chip
Materials science
Fan-out
Wafer
Correction
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