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Eric Beyne
Eric Beyne
IMEC
Chip
Materials science
Optoelectronics
Flip-flop
Bandwidth (signal processing)
4
Papers
36
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2024
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Efficient Backside Power Delivery for High-Performance Computing Systems
2022
IEEE Transactions on Very Large Scale Integration Systems
Hesheng Lin
Geert Van der Plas
Xiao Sun
Dimitrios Velenis
Francky Catthoor
Rudy Lauwereins
Eric Beyne
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84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor
2022
IEEE Transactions on Very Large Scale Integration Systems
Hesheng Lin
Dimitrios Velenis
Philip Nolmans
Xiao Sun
Francky Catthoor
Rudy Lauwereins
Geert Van der Plas
Eric Beyne
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High density and high-bandwidth chip-to-chip connections with 20μm pitch flip-flop chip on fan-out wafer level package
2018
Arnita Podpod
Dimitrios Velenis
Alain Phommahaxay
Pieter Bex
Ferenc Fodor
Erik Jan Marinissen
Kenneth June Rebibis
Andy Miller
Gerald Beyer
Eric Beyne
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Elimination of the axial deformation problem of Cu-TSV in 3D integration
2010
Chukwudi A. Okoro
Cedric Huyghebaert
Jan Van Olmen
Riet Labie
Konstantina Lambrinou
Bart Vandevelde
Eric Beyne
Dirk Vandepitte
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Citations (36)
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