Endochronic Fatigue Life Prediction of SN/3.5AG/0.75CU BGA Solder Joints Under Oblique Displacement Cyclic Tests

In this paper, cyclic damage behavior of cyclically load drop curves and their fatigue initiation life of Sn/3.5 Ag/0.75Cu BGA solder joint specimens under oblique displacement cyclic tests were investigated by the theory of damage — coupled endochronic viscoplasticity.By linearly unloading with damage elastic modulus and the linearly damage-free behavior of grip system, the damage loops of force-Φ angle oblique displacement of BGA solder joint specimen were converted successfully into damage loops of the representative solder ball under cyclically proportional straining, which can be predicted by the endochronic constitutive equations. These results established the relationship of the BGA oblique displacement amplitudes da(Φ) and the effective inelastic strain amplitudes of solder ball: da (Φ)= . Based on the phenomena of cyclic damage and its fatigue life, a Φ dependent degree of damage in the evolution equation of damage under proportional strain path was proposed to depend positively on and N cycles. Using this parameter in the damage per cycle computed by the endochronic theory, a Φ modified cycles N(Φ)/β(Φ) can be defined and then derive the Φ modified Lee-Coffin-Manson (Φ-LCM) equation for the fatigue initiation life of solder ball:Finally, a Φ modified Lee's BGA (Φ LBGA) equation for BGA solder joint specimens can be derived:This equation can predict quite well the life data of Sn/3.5Ag/0.75Cu solder joint specimens under Φ ϵ [0π/2]. As a consequence, a vehicle to study the fatigue initiation life of BGA solder joint specimens is constructed completely by the workable methodology and the theory discussed in the paper.