The Development Trend of Palladium-plated Bonding Copper Wire

The plating palladium on copper wire can effectively increase oxidation-resistance and then improve bonding property.The Pd-plated copper bonding wire of superior comprehensive performance will be new material suitable for connecting wire on semiconductor packaging.The developmental situation at home and abroad,the research background,the technology of palladium plating and the comparison among gold wire,copper wire and Pd-plated copper wire are reviewed.