Encapsulation glue Effect of Encapsulation Glue on Micromachined Thermal Wind Sensor

In this article, experiments are performed to investigate the effect of encapsulation glue on the micromachined wind sensor. The wind sensor is fabricated by micro-electro-mechanical systems (MEMS) technology on the ceramic substrate. Three kinds of packaging glues with different thermal conductivity are utilized to protect the front surface of the chip and the bonding wires. Controlled by the specific circuits, the wind sensor operating on constant power mode is tested in the wind tunnel. Experiments demonstrate that the output voltage increases with the wind speed up to 41ms and varies with the wind direction from 0 to 360. Moreover, it is found that the smaller the thermal conductivity of glue, the higher the output voltage.