Proceedings of the eighth symposium on plasma processing

This proceedings volume contains the papers presented at the Eighth Symposium on Plasma Processing, held in Montreal, Canada, May 6--11 1990. The Symposium was sponsored by the Dielectric Science and Technology (formerly called Dielectrics and Insulation) and Electronics Divisions of the Society. The papers, all oral presentations, were organized into six topical sessions, with eight invited speakers. The volume in-includes both invited and contributed papers. The most talked about topics during this symposium were ECR and Magnetic Field Enhanced plasma processes. This is evident from the two sessions devoted entirely to these technologies and several papers on these topics in other sessions as well. In order to capture the spirit of these fast emerging low pressure plasma technologies, an informal discussion on ECR Technology: Potentials and Limitations was held on Wednesday evening. It is clear that low pressure etching is assuming new significance as feature sizes get smaller and anisotropy requirements become more stringent. Concern about device damage in the future submicron devices is generating overwhelming interest in high density and low energy plasmas with controlled biasing of the wafer. Many ECR and Magnetron configurations are now commercially available.