In situ nanomechanical measurement of Cu nanowires

Copper nanowire is a potential material used as interconnect or component in the micro/ nano devices because of its high electrical and thermal conductivity. Therefore, quantitative measurement of mechanical properties of Cu nanowire is essential to the development of novel micro/nano devices. Here, in situ 3-point bending experiment is performed to measure the elastic properties of Cu nanowire using a SEM/SPM hybrid system. The experimental results show that the elastic modulus of Cu nanowire is significant size dependency in the research range.