Highly accelerated stress test and reliability analysis for build-up circuits

The demand for higher density circuitry in semiconductor packaging has led to an increase in demand for organic packaging materials. The organic substrates used for high-end MPU's and MCM's are fabricated using build-up technologies. In this paper, accelerated temperature and humidity reliability testing results for such built-up substrates are presented. In addition, a relationship between the mean time to failure of these substrates and water vapor concentration is introduced. This relationship simplifies organic substrate life prediction infield environments and reduces the time required for substrate reliability evaluations.