Old Web
English
Sign In
Acemap
>
Paper
>
Multi-chip assemblies combining wire bond and flip-chip package technologies
Multi-chip assemblies combining wire bond and flip-chip package technologies
2020
N. Yu. Ershova
Sergey Reginya
P. V. Lunkov
D. A. Kirienko
Keywords:
Materials science
Optoelectronics
Wire bonding
Flip chip
Chip
Correction
Source
Cite
Save
Machine Reading By IdeaReader
3
References
0
Citations
NaN
KQI
[]