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P. V. Lunkov

Petrozavodsk State University

6

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7

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Modeling of Thermal Processes in “Package-on-Package” Type Multichip Microcircuits

2021 Russian Electrical Engineering
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Design, fabrication and testing of the package-on-package microcircuit

2021
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Multi-chip assemblies combining wire bond and flip-chip package technologies

2020
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Electrical testing of small-series multi-chip microcircuit samples combining Wire Bond and Flip-Chip technologies

2020
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Modular hardware platform for the development of IoT devices implemented using multi-chip packaging technology

2020
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Hardware and software architecture of multi mems sensor inertial module

2017 ICINS | Saint Petersburg International Conference on Integrated Navigation Systems
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Citations (6)