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Study on copper thin films deposited onto titanium nitride layer for ultra-large scale integration
Study on copper thin films deposited onto titanium nitride layer for ultra-large scale integration
2003
M.-C. Kim
N. I. Cho
K. Y. Jun
Y. Shimogaki
Keywords:
Science, technology and society
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copper thin film
Chemical substance
Materials science
Titanium nitride
Nanotechnology
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ultra large scale integration
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