Fabrication of High Capacitance Density Capacitor Using Spray Coated Ba0.6Sr0.4TiO3 Thin Films

The integration of decoupling capacitors with high capacitance density on interposers for 3D electronics packaging requires innovative approaches for dielectric layer deposition. In this paper, we report the development of a novel and low-cost spray coating technique for the fabrication of thin film metal-insulator-metal (MIM) capacitors. We focus on thin films based on Ba0.6Sr0.4TiO3 nanoparticles synthetized using the continuous and scalable supercritical fluid process. The obtained capacitance density agrees with the state-of-the art and a reduction of the leakage current is achievable by grafting specific ligands on the nanoparticle surface. Despite the presence of leakage current which must be still optimized, the overall performance is promising for 3D electronic packaging