Research Progress of the Preparation and Application of Low Dielectric Materials

This paper is about the preparation of polymer/hollow silica spheres composites with outstanding performances such as high thermal conductivity, low dielectric constant, low dielectric loss, thermal stability ,etc. And the obtained composites are mainly used in high-frequency circuit substrate, packaging materials and connector materials and so on. Research the preparation technology of a new high-stability low-loss dielectric polymer nano-composite materials, get the experience of design and characterization of materials and explore the law of structure and dielectric properties of materials, it is great value for the development of the new polymer materials and new products in electronic information industry.