A thermoelectric module

A method for bonding a thermoelectric element to an electrical interconnect, the method comprising: providing a thermoelectric element having a first layer thereon, the first layer being metallic and having a melting point T1; providing an electrical interconnect having a melting point T2 or an electrical interconnect having a second layer thereon, the second layer being metallic and having a melting point T2; applying a third layer, and stacking the thermoelectric element and the electrical interconnect together so that the third layer is disposed between the first layer and the electrical interconnect or between the first and second layers, the third layer being metallic, having a melting point T3 and comprising at least 90at% aluminium; wherein the melting point T3 is lower than the melting point T1 and the melting point T2; performing a heat treatment, wherein the aluminium from the third layer reacts with at least one of the first layer, the electrical interconnect and the second layer to form one or more intermetallic compound; and cooling the intermetallic compound(s) such that the thermoelectric element and the electrical interconnect are bonded together.