Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging

Tim Champagne,Jay Chao,Kazuyasu Tanaka,Ramachandran Trichur,Rong Zhang

Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging

2019

Tim Champagne
Jay Chao
Kazuyasu Tanaka
Ramachandran Trichur
Rong Zhang

Advanced semiconductor packaging landscape is rapidly evolving to accommodate requirements of front end node shrink and performance expectations from emerging applications in big data, artificial i...

Keywords:

Compression molding
Materials science
Integrated circuit packaging
Composite material
Front and back ends
Mechanical engineering
Semiconductor
Molding (process)

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