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Jay Chao
Jay Chao
Materials science
Compression molding
Composite material
Integrated circuit packaging
Wafer-level packaging
6
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1
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Low Warpage Liquid Compression Molding (LCM) Material for High Density Fan-out and Wafer Level Packaging Applications
2020
ECTC | Electronic Components and Technology Conference
Jay Chao
Rong Zhang
Tu Do
AnhBinh Tong
Yijia Ma
David Grimes
Ramachandran Trichur
Lirong Bao
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Ultra-low Warpage and Anhydride-free LCM Materials for Advanced Semiconductor Packaging
2019
Tim Champagne
Jay Chao
Kazuyasu Tanaka
Rong Zhang
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Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging
2019
Tim Champagne
Jay Chao
Kazuyasu Tanaka
Ramachandran Trichur
Rong Zhang
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Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging
2019
Tim Champagne
Jay Chao
Kazuyasu Tanaka
Ramachandran Trichur
Rong Zhang
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Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging
2019
Tim Champagne
Jay Chao
Kazuyasu Tanaka
Ramachandran Trichur
Rong Zhang
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In-line process monitoring of advanced packaging process using Focused Beam Ellipsometry
2015
Microelectronic Engineering
Parker Huang
YiYen Liu
Jay Chao
Chun-Hung Lu
Stephen Chen
Jay Chen
Fei Shen
Jian Ding
Priya Mukundhan
Timothy Kryman
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