Encapsulation of traces of semiconductor devices

A method for encapsulating conductive traces of semiconductor devices and such a structure. An encapsulating protective material (50) comprising TaN, Ta, Ti, TiN or combinations of these materials, to conductor tracks (18) of a semiconductor device (10) is arranged. The encapsulating protective material (50) protects the conductor tracks (18) against aggressive etchants, when a subsequently deposited layer of material is patterned and etched. The encapsulating protective material (50) is conductive and can be left in the finished semiconductor device. The encapsulating protective material (50) is structured using a masking material and the processing of the semiconductor device is then continued. The masking material may be left as part of a subsequently deposited layer of insulating material.