Old Web
English
Sign In
Acemap
>
Paper
>
Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process
Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process
2008
Krzysztof Malecki
Gernot Bock
Gerhard Hillmann
K. Friedel
Keywords:
Anodic bonding
Chip
Wire bonding
Wafer
Materials science
Electronic engineering
bonding process
Composite material
thermo mechanical
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]