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Gernot Bock
Gernot Bock
Wafer
Materials science
Wafer bonding
Electronic engineering
Wire bonding
4
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18
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Handling of Thin Dies with Emphasis on Chip-to-Wafer Bonding
2011
Fabian Schnegg
Hannes Kostner
Gernot Bock
Stefan Engensteiner
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A Numerical Study on Heat Flow and Load Distribution During Chip to Wafer or Wafer to Wafer Bonding in Vacuum
2008
EPTC | Electronics Packaging Technology Conference
Krzysztof Malecki
Lukasz Pikur
Tomasz Falat
Gernot Bock
Gerhard Hillmann
Alfred Sigl
Norman Marenco
Kazimierz Friedel
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Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process
2008
Krzysztof Malecki
Gernot Bock
Gerhard Hillmann
K. Friedel
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Vacuum Encapsulation of Resonant MEMS Sensors by Direct Chip-to-Wafer Stacking on ASIC
2008
EPTC | Electronics Packaging Technology Conference
Norman Marenco
Wolfgang Reinert
Stephan Warnat
Peter Lange
Sven Gruenzig
Gerhard Hillmann
H Kostner
Gernot Bock
S. Guadagnuolo
A. Conte
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Citations (9)
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