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H Kostner
H Kostner
Engineering
Automotive engineering
Embedded system
Materials science
Application-specific integrated circuit
5
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24
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Investigation of key technologies for System-in-Package integration of inertial MEMS
2009
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Norman Marenco
Wolfgang Reinert
Stephan Warnat
Peter Lange
Sven Gruenzig
Giorgio Allegato
Gerhard Hillmann
H Kostner
W. Gal
S. Guadagnuolo
A. Conte
Krzysztof Malecki
K. Friedel
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Citations (13)
Vacuum Encapsulation of Resonant MEMS Sensors by Direct Chip-to-Wafer Stacking on ASIC
2008
EPTC | Electronics Packaging Technology Conference
Norman Marenco
Wolfgang Reinert
Stephan Warnat
Peter Lange
Sven Gruenzig
Gerhard Hillmann
H Kostner
Gernot Bock
S. Guadagnuolo
A. Conte
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Citations (9)
Cost modelling for embedded component technology
2007
EMPC | European Microelectronics and Packaging Conference
J. De Baets
Geert Willems
A. Ostmann
A Kriechbaum
H Kostner
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SAFETY HELMETS FOR MOTORCYCLISTS
1988
H Kostner
H. Öry
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IMPROVEMENT OF THE PROTECTIVE EFFECTS OF MOTORCYCLE HELMETS BASED ON A MATHEMATICAL STUDY
1988
H Kostner
U W Stocker
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Citations (2)
1