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S. Guadagnuolo
S. Guadagnuolo
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Materials science
Application-specific integrated circuit
Electronic engineering
System in package
3
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25
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Investigation of key technologies for System-in-Package integration of inertial MEMS
2009
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Norman Marenco
Wolfgang Reinert
Stephan Warnat
Peter Lange
Sven Gruenzig
Giorgio Allegato
Gerhard Hillmann
H Kostner
W. Gal
S. Guadagnuolo
A. Conte
Krzysztof Malecki
K. Friedel
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Citations (13)
Vacuum Encapsulation of Resonant MEMS Sensors by Direct Chip-to-Wafer Stacking on ASIC
2008
EPTC | Electronics Packaging Technology Conference
Norman Marenco
Wolfgang Reinert
Stephan Warnat
Peter Lange
Sven Gruenzig
Gerhard Hillmann
H Kostner
Gernot Bock
S. Guadagnuolo
A. Conte
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Citations (9)
On the suitability of getter-purified hydrogen for the LP-MOVPE of (AlGa)As: a comparison to Pd-diffused hydrogen
2001
Journal of Electronic Materials
H. Hardtdegen
R. Schmidt
K. Wirtz
A. Mueck
S. Guadagnuolo
G. Vergani
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Citations (3)
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