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Electro-thermal simulation of multi-channel power devices on PCB with SPICE
Electro-thermal simulation of multi-channel power devices on PCB with SPICE
2009
Hauck
Teulings
Rudnyi
Keywords:
thermal simulation
Spice
Power semiconductor device
multi channel
Finite element method
Thermal analysis
Electronic engineering
Equivalent circuit
Printed circuit board
Computer science
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