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A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive
A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive
2018
Yu-Jeong Kim
Jin-Hyeon Lee
Gi-Mun Park
Bong-Yeong Yu
Keywords:
Through-silicon via
Cobalt
Chemical engineering
Materials science
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