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In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Effect of Growth Rate and Additives
In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Effect of Growth Rate and Additives
2018
Joe A. Murphy
Catherine Lenihan
Maria Rybalchenko
Nathan Quill
Andrea Bourke
Michael O'Grady
Robert P. Lynch
D. Noel Buckley
Keywords:
Copper
Materials science
Inorganic chemistry
Chemical engineering
Growth rate
In situ
Correction
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